Automated Laser Ablation System — Multi-System Integration

Project Overview

An existing laser system for selective ablation patterning of thin film conductive metal oxide coatings from glass substrates had been operating entirely on manual process parameters, creating inconsistent results, risk of substrate damage, and poor performance when processing gradient thickness coatings. A prior PLC swap had also left the system without accurate as-built documentation. This engagement automated all process variables through custom electronics and multi-system integration, while rebuilding the system's electrical, operating, and maintenance documentation from the ground up.

Challenge

• •No automated control of laser power or pulse repetition frequency relative to coating thickness — engineer required to change parameters manually depending on product
• •Circuit diagrams not updated following a previous integrator's PLC swap from AutomationDirect to Allen-Bradley, leaving no accurate as-built records
• •No operation, troubleshooting, or maintenance documentation provided with system
• •Inconsistent parameters causing substrate damage and process variability across production runs

Approach

• •Designed and manufactured a custom voltage controlled oscillator PCB to translate analog voltage output from the robot into laser pulse repetition frequency, enabling dynamic frequency control
• •Installed a new analog output module in the Yaskawa DX200 controller cabinet and wired a four-point integration: DX200 → PLC cabinet → VCO PCB → laser control board
• •Modified the Allen-Bradley CompactLogix program to implement circuit control and coordinate signal routing between systems
• •Programmed the Yaskawa MH12 with coating-thickness-dependent recipes from development trials, modulating both power voltage and pulse frequency per zone to ablate coating without substrate damage
• •Identified circuit diagrams had not been updated since previous PLC swap; redrew complete as-built electrical documentation in AutoCAD Electrical from the ground up
• •Created new system architecture documentation de novo detailing components, interconnects, and three levels of technical documentation (operator, engineer, and maintenance)

Outcome